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News & Events

posted on 17. October 2019

Blechexpo 2019 in Stuttgart

News, 17. October 2019

on the 05th to 08th of November at booth 1107 (Hall 1) WiCAM will present the current range of CAD / CAM / Nesting / Bending – Software for sheet metal manufacturers.

The latest development stages of the PN product line for the ERP-integrated fully automatic programming and process control of all types of CNC punching, laser, water, flame cutting, knife, bending and combination machines can be seen.

In addition to hundreds of detailed improvements and new PPS / ERP interfaces, we present the current PN4000 version with 3D integration. Via this interface, various 3D formats such as STEP and files from all major CAD-systems can be read directly / automatically.

Please send your request for a personal conversation or a presentation at the Blechexpo to Mr. Guido Herz – guido.herz@wicam.com. We look forward to welcome you at our booth.

Exhibitions & Events

Advanced Manufacturing

14. - 16.05.2024 | Exhibition

In-house exhibition

our Software Products

CAD/CAM System

PN4000

CADCAM/Nesting solution for ERP/PPS controlled CNC cutting, punching, shearing, milling and combined machining

Order Management

PNControl

Order management, detailed planning, production feedback and monitoring of deadlines and production.

Bending

PNBend

Bend simulation and offline programming of CNC press brakes from various manufacturers.

Calculation

PNCalculate

Online unfolding, calculation, CAD and NC format conversion, parametric component creation.

Contact

WiCAM GmbH
Technische Software

Reetzstraße 46c
76327 Pfinztal-Söllingen
Germany

Phone: +49 7240 9259-0
E-Mail: info@wicam.com

News

NC Converter | New features in version V1.4.14

In the current version, we have improved the user-friendliness and updated the existing machines.

PN4000 | chamfer detection | available from version 32.52.

From version 32.52, our customers can automatically recognize all types of chamfers in our PN4000 programming system and transfer them directly from the 3D model to 2D processing.

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